COMBINED SELF-FORMING BARRIER AND SEED LAYER BY ATOMIC LAYER DEPOSITION
An electrically conductive structure in an integrated circuit (IC) includes recessed features in a dielectric layer filled with metal. The recessed features include a conformal, self-forming diffusion barrier and seed layer to limit oxidation of the metal into ions that will diffuse through the diel...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
21.09.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | An electrically conductive structure in an integrated circuit (IC) includes recessed features in a dielectric layer filled with metal. The recessed features include a conformal, self-forming diffusion barrier and seed layer to limit oxidation of the metal into ions that will diffuse through the dielectric. The self-forming diffusion barrier and seed layer may also form a surface oxide layer that can be removed by an acidic solution |
---|---|
Bibliography: | Application Number: US202118041391 |