RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

A radio-frequency module includes a module substrate having main surfaces facing each other, a first base material at least partially formed of a first semiconductor material, and a second base material at least partially formed of a second semiconductor material having thermal conductivity higher t...

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Bibliographic Details
Main Authors FUKASAWA, Mikiko, YOSHIMI, Shunji, TAKEMATSU, Yuji
Format Patent
LanguageEnglish
Published 24.08.2023
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
TRANSMISSION
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Summary:A radio-frequency module includes a module substrate having main surfaces facing each other, a first base material at least partially formed of a first semiconductor material, and a second base material at least partially formed of a second semiconductor material having thermal conductivity higher than that of the first semiconductor material and in which a power amplifier circuit is formed. The first base material and the second base material are arranged on the main surface, the second base material is arranged between the module substrate and the first base material, bonded to the first base material, and connected to the main surface with an electrode interposed therebetween, one of the first base material and the second base material is connected to the main surface with an electrode interposed therebetween, and in plan view of the module substrate, an area of the electrode is larger than an area of the electrode.
Bibliography:Application Number: US202318311316