ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH ELEVATED TRACE FEATURES FOR SOLDER AND/OR DIE CONFINEMENT

• Main Authors: Tang, Yiqi, Murugan, Rajen Manicon, Li, Guangxu
• Format: Patent
• Language: English
• Published: 24.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electronic device with a multilevel package substrate having multiple levels including a first level having conductive leads and a final level having conductive landing areas along a side, as well as a die mounted to the multilevel package substrate and having conductive terminals electrically coupled to respective ones of the conductive leads, and a package structure that encloses the die and a portion of the multilevel package substrate, where the multilevel package substrate has a conductive elevated trace layer with a confinement feature that extends outward from the side of the final level along a third direction that is orthogonal to the first and second directions, the confinement feature having a sidewall configured to laterally confine one of a solder, an adhesive, a side of a passive component, and a side of the die.