STOPPER BUMP STRUCTURES FOR MEMS DEVICE

Various embodiments of the present disclosure are directed towards an integrated chip (IC) including a substrate. A plurality of adhesive structures is disposed on the substrate. A microelectromechanical systems (MEMS) structure is disposed on the adhesive structures. The MEMS structure comprises a...

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Bibliographic Details
Main Authors Mao, Wei-Jhih, Chang, Kuei-Sung, Cheng, Chun-Wen, Tsai, Shang-Ying
Format Patent
LanguageEnglish
Published 17.08.2023
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
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Summary:Various embodiments of the present disclosure are directed towards an integrated chip (IC) including a substrate. A plurality of adhesive structures is disposed on the substrate. A microelectromechanical systems (MEMS) structure is disposed on the adhesive structures. The MEMS structure comprises a movable element disposed within a cavity. A first plurality of stopper bumps is disposed between the movable element and the substrate.
Bibliography:Application Number: US202217690768