SEMICONDUCTOR DEVICE

A semiconductor device includes: a substrate; a contact plug on the substrate; a lower electrode electrically connected to the contact plug, and including a first electrode layer, a first buffer layer, and a second electrode layer, sequentially stacked; a first support layer in contact with an upper...

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Bibliographic Details
Main Authors Chae, Hongsik, Lim, Hanjin, Lim, Yirang, Jung, Hyungsuk, Kim, Taekyun, Lee, Jinsu
Format Patent
LanguageEnglish
Published 10.08.2023
Subjects
ELECTRICITY
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Summary:A semiconductor device includes: a substrate; a contact plug on the substrate; a lower electrode electrically connected to the contact plug, and including a first electrode layer, a first buffer layer, and a second electrode layer, sequentially stacked; a first support layer in contact with an upper surface of the lower electrode and disposed to overlap at least a portion of the lower electrode, the first support layer extending in a direction parallel to an upper surface of the substrate; a dielectric layer disposed on the lower electrode and the first support layer; and an upper electrode disposed on the dielectric layer. The lower electrode comprises a first region overlapping the first support layer, and having a first height; and a second region not overlapping the first support layer, and having a second height lower than the first height.
Bibliography:Application Number: US202217993943