SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

• Main Authors: MASUDA, YOSHIAKI, KANEGUCHI, TOKIHISA
• Format: Patent
• Language: English
• Published: 10.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present technology relates to a semiconductor package and a method for manufacturing the semiconductor package that are capable of improving the quality of the semiconductor package having a WCSP structure. A semiconductor package includes: a semiconductor substrate including a light receiving e...