SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

The present technology relates to a semiconductor package and a method for manufacturing the semiconductor package that are capable of improving the quality of the semiconductor package having a WCSP structure. A semiconductor package includes: a semiconductor substrate including a light receiving e...

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Bibliographic Details
Main Authors MASUDA, YOSHIAKI, KANEGUCHI, TOKIHISA
Format Patent
LanguageEnglish
Published 10.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present technology relates to a semiconductor package and a method for manufacturing the semiconductor package that are capable of improving the quality of the semiconductor package having a WCSP structure. A semiconductor package includes: a semiconductor substrate including a light receiving element; an on-chip lens disposed on an incident surface side of the semiconductor substrate; a resin layer in contact with a central portion including a most protruding portion of the on-chip lens; and a glass substrate in contact with a surface of the resin layer opposite to a surface of the resin layer in contact with the on-chip lens, wherein a space is provided between a peripheral portion around the central portion of the on-chip lens and the resin layer. The present technology can be applied to, for example, an imaging element.
Bibliography:Application Number: US202118003448