SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

To facilitate connection with an external wiring when an electrode pad is located at a deep position from a surface of a semiconductor device. The electrode pad is formed at a predetermined depth from the surface of the substrate. A conductive portion is formed in a region from the electrode pad to...

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Bibliographic Details
Main Author OOTAKI, YUTAKA
Format Patent
LanguageEnglish
Published 10.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To facilitate connection with an external wiring when an electrode pad is located at a deep position from a surface of a semiconductor device. The electrode pad is formed at a predetermined depth from the surface of the substrate. A conductive portion is formed in a region from the electrode pad to the surface of the substrate. The conductive portion has a state in which it can be electrically connected to the wiring on the surface of the substrate. The conductive portion includes a wiring region for electrical connection with a wiring at a position directly above the electrode pad on the surface of the substrate or at a position different from the position directly above the electrode pad. The conductive portion can be formed by repeating a procedure of applying a conductive paste to a region from the electrode pad to the surface of the substrate and a procedure of curing the applied conductive paste.
Bibliography:Application Number: US202118005010