ULTRASOUND VIBRATING-TYPE DEFECT DETECTION APPARATUS AND WIRE DEFECT DETECTION SYSTEM

An ultrasound vibrating-type defect detection apparatus (100) for detecting a defect in a semiconductor apparatus (10) is provided with: an ultrasound vibrator (42); a high-frequency power supply (40); a camera (45); and a controller (50) for adjusting the frequency of high-frequency power supplied...

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Bibliographic Details
Main Authors ADACHI, Takuya, KIRKBY, Michael, MUNAKATA, Hiroshi
Format Patent
LanguageEnglish
Published 10.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FOR PERFORMING MECHANICAL WORK IN GENERAL
GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY
PERFORMING OPERATIONS
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
TRANSPORTING
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Summary:An ultrasound vibrating-type defect detection apparatus (100) for detecting a defect in a semiconductor apparatus (10) is provided with: an ultrasound vibrator (42); a high-frequency power supply (40); a camera (45); and a controller (50) for adjusting the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and for performing detection of a defect in the semiconductor apparatus (10). The controller (50) causes the camera (45) to capture an image of the semiconductor apparatus (10) while varying the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and performs detection of a defect in the semiconductor apparatus (10) on the basis of the captured image.
Bibliography:Application Number: US202018015074