BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE

A system for attaching a terminal pin to a circuit trace on an electronic substrate. The system includes a sonotrode and a stage for holding the electronic substrate. The sonotrode is configured to direct ultrasound energy to a base region of the terminal pin placed on the circuit trace to weld the...

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Bibliographic Details
Main Authors KRISHNAN, Shutesh, LOW, Pui Leng, YBORDE, Dennis Cadiz, TOLENTINO, Erik Nino Mercado
Format Patent
LanguageEnglish
Published 03.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
SEMICONDUCTOR DEVICES
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Summary:A system for attaching a terminal pin to a circuit trace on an electronic substrate. The system includes a sonotrode and a stage for holding the electronic substrate. The sonotrode is configured to direct ultrasound energy to a base region of the terminal pin placed on the circuit trace to weld the base region to the circuit trace. The system further includes a three-dimensional positioner coupled to the sonotrode. The three-dimensional positioner is configured to drive the sonotrode to lift the terminal pin from a rack and to place the terminal pin on the electronic substrate.
Bibliography:Application Number: US202318298148