WHIPPED FORMULATIONS
The present disclosure relates to, inter alia, a formulation in a package, the formulation comprises one or more active agents and is co-mingled with a whipping agent prior to being filled under pressure into the package. The whipping agent is added in sufficient amounts to be dispersed in the formu...
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Main Authors | , , , , , , , , , , |
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Format | Patent |
Language | English |
Published |
27.07.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure relates to, inter alia, a formulation in a package, the formulation comprises one or more active agents and is co-mingled with a whipping agent prior to being filled under pressure into the package. The whipping agent is added in sufficient amounts to be dispersed in the formulation. The pressurized package is under sufficient pressure suitable to maintain the whipping agent dispersed in the formulation; and the pressurized package is under sufficient pressure to expel the formulation as a whipped formulation upon application of external force on the formulation in the package. |
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Bibliography: | Application Number: US202318126138 |