SUBSTRATE STRUCTURE, MODULE, METHOD FOR MANUFACTURING THE SUBSTRATE STRUCTURE, AND METHOD FOR MANUFACTURING THE MODULE

A substrate structure comprises a substrate having a first surface, a first electrode disposed on the first surface, a bump connected to the first electrode, and a protective member that covers the first surface and covers a portion of the bump. The protective member has an opening. The bump include...

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Bibliographic Details
Main Authors YOSHIMORI, Hiroki, NAKAGOSHI, Hideo, TAKAKURA, Tsuyoshi, OTSUBO, Yoshihito, KITA, Ryoichi, NOMURA, Tadashi
Format Patent
LanguageEnglish
Published 20.07.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A substrate structure comprises a substrate having a first surface, a first electrode disposed on the first surface, a bump connected to the first electrode, and a protective member that covers the first surface and covers a portion of the bump. The protective member has an opening. The bump includes a portion exposed through the opening. The bump includes a first portion that is connected to the first electrode, and a second portion that is located farther from the first electrode than the first portion and is connected to the first portion. The bump has a constriction at a boundary between the first portion and the second portion. When viewed in a direction perpendicular to the first surface, a maximum diameter of the second portion is smaller than a maximum diameter of the first portion.
Bibliography:Application Number: US202318188538