SYSTEMS AND METHODS FOR COOLING ELECTRICAL EQUIPMENT

The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit...

Full description

Saved in:
Bibliographic Details
Main Authors Zhang, Ming, Costakis, John
Format Patent
LanguageEnglish
Published 13.07.2023
Subjects
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBINED HEATING AND REFRIGERATION SYSTEMS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT PUMP SYSTEMS
HEATING
LIGHTING
LIQUEFACTION SOLIDIFICATION OF GASES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MANUFACTURE OR STORAGE OF ICE
MECHANICAL ENGINEERING
PRINTED CIRCUITS
REFRIGERATION MACHINES, PLANTS OR SYSTEMS
REFRIGERATION OR COOLING
WEAPONS
Online AccessGet full text

Cover

More Information
Summary:The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.
Bibliography:Application Number: US202318097055