SYSTEMS AND METHODS OF NANO-PARTICLE BONDING FOR ELECTRONICS COOLING

Devices and methods for providing cooling to electronics equipment is provided herein. A cooling manifold includes a first substrate having a first hole. A layer of nano-particles is disposed between the first substrate and an electronics surface associated with the electronics equipment. The layer...

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Bibliographic Details
Main Author Sutherland, James Scott
Format Patent
LanguageEnglish
Published 06.07.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES
NANOTECHNOLOGY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
TRANSPORTING
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Summary:Devices and methods for providing cooling to electronics equipment is provided herein. A cooling manifold includes a first substrate having a first hole. A layer of nano-particles is disposed between the first substrate and an electronics surface associated with the electronics equipment. The layer of nano-particles defines a seal between the first substrate and the electronics surface, and further defines a channel extending within the seal. After an application of heat, the layer of nano-particles forms the seal such that the device is fluid impermeable, so as to allow a coolant fluid to enter through the first hole to flow through the channel to reduce or remove the heat generated by the electronics equipment associated with the electronics surface.
Bibliography:Application Number: US202318092999