REMOTE PLASMA UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING REMOTE PLASMA

• Main Author: Miao, Zhikai
• Format: Patent
• Language: English
• Published: 06.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A substrate processing apparatus is disclosed. Exemplary substrate processing apparatus includes a reaction chamber; a remote plasma unit; a cleaning gas lines configured to fluidly couple the remote plasma unit to the reaction chambers ; and a chamber liner disposed in a sidewall of the reaction chamber; wherein the cleaning gas line is connected to the sidewall of the reaction chamber through a cleaning gas opening; wherein the chamber liner is provided with a plurality of holes, being fluidly coupled to the cleaning gas opening.