QUASI-MONOLITHIC INTEGRATED PACKAGING ARCHITECTURE WITH MID-DIE SERIALIZER/DESERIALIZER

A microelectronic assembly is provided, comprising: a first integrated circuit (IC) die having a first connection to a first serializer/deserializer (SERDES) circuit and a second connection to a second SERDES circuit; a second IC die having the first SERDES circuit; and a third IC die having the sec...

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Bibliographic Details
Main Authors Singh, Tejpal, Pasdast, Gerald S, Wang, Peipei, Liff, Shawna M, Elsherbini, Adel A, Nassif, Nevine, Molnar, Carleton L, Rajan, Vivek Kumar, Swan, Johanna M
Format Patent
LanguageEnglish
Published 22.06.2023
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