QUASI-MONOLITHIC INTEGRATED PACKAGING ARCHITECTURE WITH MID-DIE SERIALIZER/DESERIALIZER
A microelectronic assembly is provided, comprising: a first integrated circuit (IC) die having a first connection to a first serializer/deserializer (SERDES) circuit and a second connection to a second SERDES circuit; a second IC die having the first SERDES circuit; and a third IC die having the sec...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | English |
Published |
22.06.2023
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Subjects | |
Online Access | Get full text |
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