Semiconductor Package, Semiconductor Die and Method for Forming a Semiconductor Package or a Semiconductor Die

A semiconductor package comprises a semiconductor die and a wiring structure, which is electrically connected to the semiconductor die. Further, the semiconductor package comprises a magnetic material. The magnetic material embeds and/or encircles a portion of the wiring structure.

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Bibliographic Details
Main Authors MOLZER, Wolfgang, GOSSNER, Harald, SEIDEMANN, Georg, LANGENBUCH, Michael, WAIDHAS, Bernd
Format Patent
LanguageEnglish
Published 22.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package comprises a semiconductor die and a wiring structure, which is electrically connected to the semiconductor die. Further, the semiconductor package comprises a magnetic material. The magnetic material embeds and/or encircles a portion of the wiring structure.
Bibliography:Application Number: US202117644803