METHODS OF INSTALLING A PURGE FLUID CONDITIONING ELEMENT INTO A SEMICONDUCTOR SUBSTRATE CARRYING CONTAINER

Methods of installing a purge fluid conditioning element into an interior space of a semiconductor substrate carrying container are described. The purge fluid conditioning element is installed from outside the semiconductor substrate carrying container through a port formed in one of the walls of th...

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Bibliographic Details
Main Authors Eggum, Shawn D, Fuller, Matthew A, Smith, Mark V
Format Patent
LanguageEnglish
Published 22.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Methods of installing a purge fluid conditioning element into an interior space of a semiconductor substrate carrying container are described. The purge fluid conditioning element is installed from outside the semiconductor substrate carrying container through a port formed in one of the walls of the container, where the port is sized to permit the purge fluid conditioning element to be inserted into the interior space of the container by installing the purge fluid conditioning element through the port. The wall may be a bottom wall of the container or another wall of the container. The described methods eliminate the need to install the purge fluid conditioning element from the inside of the container which can cause human contamination of the interior environment of the container.
Bibliography:Application Number: US202217827300