APPARATUS AND METHOD FOR TREATING SUBSTRATE

An apparatus and method for treating a substrate are provided. The apparatus includes at least one first process chamber configured to supply a developer onto the substrate; at least one second process chamber configured to treat the substrate using a supercritical fluid; a transfer chamber configur...

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Bibliographic Details
Main Authors ANTON, Koriakin, LEE, Jang Jin, SHIN, Seung Min, PARK, Sang Jin, PARK, Ji Hwan, SUNG, Jin Yeong, CHOI, Hae Won, WON, Joon Ho, LEE, Kun Tack, HEO, Pil Kyun
Format Patent
LanguageEnglish
Published 22.06.2023
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HANDLING THIN OR FILAMENTARY MATERIAL
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PACKING
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PNEUMATIC TUBE CONVEYORS
SEMICONDUCTOR DEVICES
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
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Summary:An apparatus and method for treating a substrate are provided. The apparatus includes at least one first process chamber configured to supply a developer onto the substrate; at least one second process chamber configured to treat the substrate using a supercritical fluid; a transfer chamber configured to transfer the substrate from the at least one first process chamber to the at least one second process chamber, while the developer supplied in the at least one first process chamber remains on the substrate; and a temperature and humidity control system configured to manage temperature and humidity of the transfer chamber by supplying a first gas of constant temperature and humidity into the transfer chamber.
Bibliography:Application Number: US202217892677