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A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
15.06.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side. |
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Bibliography: | Application Number: US202318166661 |