PACKAGE AND METHOD OF FABRICATING THE SAME
Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first die through a bonding structure thereof. The inductor is located in the bonding structure. The inductor includes a spiral pattern parallel t...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English |
| Published |
15.06.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first die through a bonding structure thereof. The inductor is located in the bonding structure. The inductor includes a spiral pattern parallel to top surfaces of the first die and the second die, and the spiral pattern includes at least a turn. |
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| AbstractList | Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first die through a bonding structure thereof. The inductor is located in the bonding structure. The inductor includes a spiral pattern parallel to top surfaces of the first die and the second die, and the spiral pattern includes at least a turn. |
| Author | Chen, Ming-Fa Shih, Chao-Wen Hu, Jen-Li Liu, Tzuan-Horng |
| Author_xml | – fullname: Liu, Tzuan-Horng – fullname: Shih, Chao-Wen – fullname: Hu, Jen-Li – fullname: Chen, Ming-Fa |
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| Notes | Application Number: US202318164646 |
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| RelatedCompanies | Taiwan Semiconductor Manufacturing Company, Ltd |
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| Snippet | Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | PACKAGE AND METHOD OF FABRICATING THE SAME |
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