PACKAGE AND METHOD OF FABRICATING THE SAME

Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first die through a bonding structure thereof. The inductor is located in the bonding structure. The inductor includes a spiral pattern parallel t...

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Bibliographic Details
Main Authors Liu, Tzuan-Horng, Shih, Chao-Wen, Hu, Jen-Li, Chen, Ming-Fa
Format Patent
LanguageEnglish
Published 15.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first die through a bonding structure thereof. The inductor is located in the bonding structure. The inductor includes a spiral pattern parallel to top surfaces of the first die and the second die, and the spiral pattern includes at least a turn.
Bibliography:Application Number: US202318164646