LIGHT RECEIVING ELEMENT AND ELECTRONIC DEVICE

• Main Authors: TADA, TAKANORI, TOSHIMA, KENJI, OONO, MAKOTO
• Format: Patent
• Language: English
• Published: 08.06.2023
• Subjects: ANALOGOUS ARRANGEMENTS USING OTHER WAVES; BASIC ELECTRIC ELEMENTS; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES; MEASURING; PHYSICS; RADIO DIRECTION-FINDING; RADIO NAVIGATION; SEMICONDUCTOR DEVICES; TESTING

To prevent the occurrence of poor connection between an electrode pad and a bonding wire.A light receiving element includes a wiring region, an electrode pad, a first recessed portion, and a second recessed portion. The wiring region is disposed next to the front side of a semiconductor substrate, the wiring region including a wiring layer for transmitting a signal and an insulating layer for insulating the wiring layer, the wiring layer being connected to a photoelectric conversion unit that is disposed in the semiconductor substrate and performs photoelectric conversion on incident light. The electrode pad is disposed in the wiring region and is connected to the wiring layer so as to be connected to the outside. The first recessed portion is formed on the back side of the semiconductor substrate and has the bottom near the front side of the semiconductor substrate and near the electrode pad. The second recessed portion is formed at the bottom of the first recessed portion and has the bottom formed on a surface of the electrode pad.