SEMICONDUCTOR CHIP AND TEST METHOD OF THE SAME

A semiconductor chip includes a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied, a first ring oscillator connected to the first node through a first supply switch and the second node through a first...

Full description

Saved in:
Bibliographic Details
Main Authors Kwak, Min Woo, Lee, Kwan Seong, Lee, Jae Ho, Choi, Jae Seung, Jung, Yeon Ho, Kim, Mi Joung, Byun, Do Hoon, Choi, Hwang Ho, Kye, Jong Wook, Park, Chan Wook
Format Patent
LanguageEnglish
Published 08.06.2023
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PULSE TECHNIQUE
TESTING
Online AccessGet full text

Cover

More Information
Summary:A semiconductor chip includes a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied, a first ring oscillator connected to the first node through a first supply switch and the second node through a first ground switch and a second ring oscillator connected to the first node through a second supply switch and the second node through a second ground switch, wherein the first supply and ground switches are configured to operate in response to a first control signal, thereby operating the first ring oscillator, and the second supply and ground switches are configured to operate in response to a second control signal, thereby operating the second ring oscillator.
Bibliography:Application Number: US202218047366