METHOD FOR PREPARING POLYIMIDE AEROGEL HAVING LOW DIELECTRIC PROPERTIES, HIGH INSULATION, AND HIGH STRENGTH, AND POLYIMIDE AEROGEL PRODUCED THEREFROM

• Main Authors: JO, Moon Jung, LEE, Dae Ho, YU, Seung Gun, PARK, Hyo Yul, HAN, Se Won
• Format: Patent
• Language: English
• Published: 08.06.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The present invention relates to: a method for producing a polyimide aerogel having low dielectric properties, high insulation, and high strength; and a polyimide aerogel prepared therefrom. The present invention has the technical gist of a method for producing a polyimide aerogel having low dielectric properties, high insulation, and high strength, and a polyimide aerogel prepared therefrom, the method including: a first step of preparing a solvent; a second step of preparing a polyamic acid resin by reacting a diamine-based monomer with an acid anhydride monomer in a solvent; a third step of preparing a polyimide resin solution by imidizing the polyamic acid resin at 150 to 200° C.; a fourth step of preparing a polyimide wet gel by mixing a crosslinking agent and an acid with the polyimide resin solution; and a fifth step of preparing a polyimide aerogel by replacing the solvent contained in the polyimide wet gel with a main substitution solvent and a minor substitution solvent and then drying, wherein, in the fifth step, the main substitution solvent and the minor substitution solvent are each added to the polyimide wet gel in a stepwise manner to produce a polyimide aerogel having the porosity of 80 to 85 vol % while forming a skeletal structure having nano-pores through solvent-exchange.