APPARATUS FOR POLISHING A WAFER AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME
A method for fabricating a semiconductor device includes providing a polishing pad which includes a first region and a second region separated from each other by a fence, loading a wafer onto the first region, providing a slurry solution onto the first region, providing an ultrapure water onto the s...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
01.06.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A method for fabricating a semiconductor device includes providing a polishing pad which includes a first region and a second region separated from each other by a fence, loading a wafer onto the first region, providing a slurry solution onto the first region, providing an ultrapure water onto the second region, turning the polishing pad to polish a surface of the wafer, and unloading the wafer from the polishing pad after polishing on the surface of the wafer is completed, wherein the fence includes a first fence extending from a center of the polishing pad toward an edge of the polishing pad in a first horizontal direction, and a second fence extending from the center of the polishing pad toward the edge of the polishing pad in a second horizontal direction different from the first horizontal direction. |
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Bibliography: | Application Number: US202217842962 |