STACKED MAGNETIC INDUCTOR AND METHOD
An electronic device and associated methods are disclosed. In one example, the electronic device includes a package with integrated inductors. In selected examples, the package includes a core layer having a core thickness and through holes. The package further includes inductor structures within th...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
25.05.2023
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Subjects | |
Online Access | Get full text |
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Summary: | An electronic device and associated methods are disclosed. In one example, the electronic device includes a package with integrated inductors. In selected examples, the package includes a core layer having a core thickness and through holes. The package further includes inductor structures within the through holes, such that an inductor structure has a length exceeding the core thickness. |
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Bibliography: | Application Number: US202117531954 |