LIGHT-EMITTING DIODE (LED) PACKAGE WITH REFLECTIVE COATING AND METHOD OF MANUFACTURE

A light-emitting diode (LED) package and method of manufacture are described. An LED package includes an LED die that has a top surface, a bottom surface and side surfaces. The package further includes a wavelength converting element having a top surface, a bottom surface and side surfaces. The bott...

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Bibliographic Details
Main Authors Tamma, Venkata Ananth, Law, Ruen Ching, Basin, Grigoriy, Fouksman, Mikhail, Hin, Tze Yang, Saw, Kok Siang
Format Patent
LanguageEnglish
Published 18.05.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A light-emitting diode (LED) package and method of manufacture are described. An LED package includes an LED die that has a top surface, a bottom surface and side surfaces. The package further includes a wavelength converting element having a top surface, a bottom surface and side surfaces. The bottom surface of the wavelength converting element is adjacent the top surface of the LED die. The package further includes a light reflecting coating surrounding at least the side surfaces of both the LED die and the wavelength converting element. The light reflective coating has at a least a portion that extends above the top surface of the wavelength converting element.
Bibliography:Application Number: US202217990450