DUAL RESISTOR INTEGRATION

An electronic device includes a first thin film resistor and a second thin film resistor above a dielectric layer that extends in a first plane of orthogonal first and second directions, the first resistor has three portions with the second portion extending between the first and third portions, and...

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Bibliographic Details
Main Authors Hong, Qi-Zhong, Srinivasan, Bhaskar, Jacobs, Jarvis Benjamin
Format Patent
LanguageEnglish
Published 18.05.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic device includes a first thin film resistor and a second thin film resistor above a dielectric layer that extends in a first plane of orthogonal first and second directions, the first resistor has three portions with the second portion extending between the first and third portions, and a recess etched into the top side of the second portion by a controlled etch process to increase the sheet resistance of the first resistor for dual thin film resistor integration.
Bibliography:Application Number: US202117525167