PACKAGE-LEVEL ESD PROTECTION

The present invention provides a package including a first pad, a die and at least one package ESD component is disclosed. The first pad is configured to receive a signal from a device external to the package. The die comprises a second pad and an internal circuit, wherein the internal circuit is co...

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Bibliographic Details
Main Authors Liao, Yu-Cheng, Huang, Bo-Shih, Jao, Che-Yuan, Lin, Yi-Chieh
Format Patent
LanguageEnglish
Published 04.05.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a package including a first pad, a die and at least one package ESD component is disclosed. The first pad is configured to receive a signal from a device external to the package. The die comprises a second pad and an internal circuit, wherein the internal circuit is configured to receive the signal from the first pad via the second pad. The at least one ESD component is positioned outside the die.
Bibliography:Application Number: US202217902912