Component Embedded in Component Carrier and Having an Exposed Side Wall

A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a furt...

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Bibliographic Details
Main Authors Leitgeb, Markus, Zluc, Andreas, Schuster, Bettina, Silvano de Sousa, Jonathan, Stahr, Hannes
Format Patent
LanguageEnglish
Published 04.05.2023
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.
Bibliography:Application Number: US202218147276