CANISTER OF SEMICONDUCTOR PRODUCT DEVICE

A canister for a semiconductor manufacturing device according to an embodiment of the present disclosure is provided with a sintered filter at the end of a dip tube into which a carrier gas is to be injected, and further provided with a porous container having excellent heat transfer rate inside a c...

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Bibliographic Details
Main Authors YANG, Il Doo, JUNG, Hoe Sun, KIM, Young Chan, Yoon, Sangwoong, KIM, Ja Yeon, PARK, Seung Bae, JUNG, Won Gyoung
Format Patent
LanguageEnglish
Published 27.04.2023
Subjects
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Summary:A canister for a semiconductor manufacturing device according to an embodiment of the present disclosure is provided with a sintered filter at the end of a dip tube into which a carrier gas is to be injected, and further provided with a porous container having excellent heat transfer rate inside a container, so that the precursor material filled inside the canister can be smoothly supplied to the thin film deposition device at a rear stage.
Bibliography:Application Number: US202217666775