PROCESSING APPARATUS USING LASER, METHOD OF PROCESSING A SUBSTRATE USING LASER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
06.04.2023
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Subjects | |
Online Access | Get full text |
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Abstract | A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles, the laser irradiation apparatus including a control unit configured to control an output of an infrared pulsed laser so that a plurality of laser spots adjacent to each other are separated from each other. |
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AbstractList | A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles, the laser irradiation apparatus including a control unit configured to control an output of an infrared pulsed laser so that a plurality of laser spots adjacent to each other are separated from each other. |
Author | OKUBO, Takuro HAYASHI, Hidekazu |
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Notes | Application Number: US202217653290 |
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RelatedCompanies | Kioxia Corporation |
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Snippet | A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
Title | PROCESSING APPARATUS USING LASER, METHOD OF PROCESSING A SUBSTRATE USING LASER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
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