PROCESSING APPARATUS USING LASER, METHOD OF PROCESSING A SUBSTRATE USING LASER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
06.04.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles, the laser irradiation apparatus including a control unit configured to control an output of an infrared pulsed laser so that a plurality of laser spots adjacent to each other are separated from each other. |
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Bibliography: | Application Number: US202217653290 |