SHAPE MEMORY POLYMER FOR USE IN SEMICONDUCTOR DEVICE FABRICATION
An integrated circuit comprises a substrate including a shape memory polymer, and a semiconductor die mounted on the substrate.
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
23.03.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | An integrated circuit comprises a substrate including a shape memory polymer, and a semiconductor die mounted on the substrate. |
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| AbstractList | An integrated circuit comprises a substrate including a shape memory polymer, and a semiconductor die mounted on the substrate. |
| Author | KUMMERL, Steven Alfred COOK, Benjamin Stassen |
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| Notes | Application Number: US202218059473 |
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| RelatedCompanies | Texas Instruments Incorporated |
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| Snippet | An integrated circuit comprises a substrate including a shape memory polymer, and a semiconductor die mounted on the substrate. |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SHAPE MEMORY POLYMER FOR USE IN SEMICONDUCTOR DEVICE FABRICATION |
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