SHAPE MEMORY POLYMER FOR USE IN SEMICONDUCTOR DEVICE FABRICATION

An integrated circuit comprises a substrate including a shape memory polymer, and a semiconductor die mounted on the substrate.

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Bibliographic Details
Main Authors COOK, Benjamin Stassen, KUMMERL, Steven Alfred
Format Patent
LanguageEnglish
Published 23.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit comprises a substrate including a shape memory polymer, and a semiconductor die mounted on the substrate.
Bibliography:Application Number: US202218059473