METHODS AND APPARATUS TO EMBED HOST DIES IN A SUBSTRATE

Methods and apparatus to embed host dies in a substrate are disclosed An apparatus includes a first die having a first side and a second side opposite the first side. The first side includes a first contact to be electrically coupled with a second die. The second side includes a second contact. The...

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Bibliographic Details
Main Authors Kanaoka, Yosuke, Pietambaram, Srinivas, Paital, Sameer, Ndukum, Tchefor, Duan, Gang
Format Patent
LanguageEnglish
Published 23.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Methods and apparatus to embed host dies in a substrate are disclosed An apparatus includes a first die having a first side and a second side opposite the first side. The first side includes a first contact to be electrically coupled with a second die. The second side includes a second contact. The apparatus further includes a substrate including a metal layer and a dielectric material on the metal layer. The first die is encapsulated within the dielectric material. The second contact of the first die is bonded to the metal layer independent of an adhesive.
Bibliography:Application Number: US202117480953