ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

An electronic device includes a first metal layer, a first insulating layer, a second metal layer and a second insulating layer. The first insulating layer is disposed on the first metal layer, the second metal layer is disposed on the first insulating layer, and the second insulating layer is dispo...

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Bibliographic Details
Main Authors KAO, Ker-Yih, TSENG, Hung-I
Format Patent
LanguageEnglish
Published 23.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic device includes a first metal layer, a first insulating layer, a second metal layer and a second insulating layer. The first insulating layer is disposed on the first metal layer, the second metal layer is disposed on the first insulating layer, and the second insulating layer is disposed between the second metal layer and the first insulating layer. The second metal layer is electrically connected to the first metal layer through a first opening of the first insulating layer and a second opening of the second insulating layer.
Bibliography:Application Number: US202217736067