RESINS FOR USE AS TIE LAYERS IN MULTILAYER FILMS AND MULTILAYER FILMS COMPRISING THE SAME

• Main Authors: Zheng, Yong, Guerra, Suzanne M, Hansen, Sydney E, Walther, Brian W
• Format: Patent
• Language: English
• Published: 16.03.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

The present disclosure provides resins that can be used as a tie layer in a multilayer structure and to multilayer structures comprising one or more tie layers formed from such resins. In one aspect, a resin for use as a tie layer in a multilayer structure comprises a first composition, wherein the first composition comprises at least one ethylene-based polymer and wherein the first composition comprises a MWCDI value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2≥7.0−1.2×log (I2), wherein the first composition comprises 1 to 99 weight percent of the resin; and a maleic anhydride grafted polyethylene comprising a maleic anhydride grafted high density polyethylene, a maleic anhydride grafted linear low density polyethylene, a maleic anhydride grafted polyethylene elastomer, or a combination thereof, wherein the maleic anhydride grafted polyethylene comprises 1 to 99 weight percent of the resin.