SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device includes a semiconductor element, a first conductive member, a second conductive member, a connecting member, and a metal plate. The semiconductor element has an element obverse surface and an element reverse surface that are spaced apart from each other in a thickness directi...

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Bibliographic Details
Main Authors YOSHIHARA, Katsuhiko, WU, Xiaopeng
Format Patent
LanguageEnglish
Published 16.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a semiconductor element, a first conductive member, a second conductive member, a connecting member, and a metal plate. The semiconductor element has an element obverse surface and an element reverse surface that are spaced apart from each other in a thickness direction. An obverse surface electrode is provided on the element obverse surface. The first conductive member faces the element reverse surface and is bonded to the semiconductor element. The first conductive member and the second conductive member are spaced apart from each other. The connecting member electrically connects the obverse surface electrode and the second conductive member. The metal plate is interposed between the obverse surface electrode and the connecting member in the thickness direction. The obverse surface electrode and the metal plate are bonded to each other by solid-phase diffusion.
Bibliography:Application Number: US202117801721