ELECTROSTATIC EDGE RING MOUNTING SYSTEM FOR SUBSTRATE PROCESSING

An edge ring system comprising a substrate support configured to support a substrate during plasma processing and including a baseplate and an upper layer arranged on the baseplate. An edge ring support includes a first body and an electrostatic clamping electrode arranged in the first body. The edg...

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Bibliographic Details
Main Authors MACE, Adam Christopher, COMENDANT, Keith, KOZAKEVICH, Felix Leib, HOLLAND, John, MARAKHTANOV, Alexei, EHRLICH, Darrell, MATYUSHKIN, Alexander
Format Patent
LanguageEnglish
Published 09.03.2023
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Summary:An edge ring system comprising a substrate support configured to support a substrate during plasma processing and including a baseplate and an upper layer arranged on the baseplate. An edge ring support includes a first body and an electrostatic clamping electrode arranged in the first body. The edge ring support is arranged above the baseplate and radially outside of the substrate during processing. An edge ring includes a second body arranged on and electrostatically clamped to the edge ring support during plasma processing.
Bibliography:Application Number: US202117796740