LOW COST EMBEDDED INTEGRATED CIRCUIT DIES

• Main Authors: Brun, Xavier Francois, Ganesan, Sanka
• Format: Patent
• Language: English
• Published: 09.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An example microelectronic assembly comprises a support structure; an interposer above the support structure; a first die in the interposer, the first die including through-substrate vias (TSVs); and a second die in the interposer, the second die lacking TSVs. A die-to-package support (DTPS) interconnect field on a first face of the first die is substantially identical to a DTPS interconnect field on a first face of the second die, the DTP interconnect fields comprising a plurality of DTPS interconnects for connecting the first and second dies to the support structure. A die-to-die (DTD) interconnect field on a second face of the first die is substantially identical to a DTD interconnect field on a second face of the second die, the DTD interconnect fields comprising a plurality of DTD interconnects.