SYSTEM AND METHOD FOR PERFORMING SEMICONDUCTOR PROCESSES WITH COATED BELL JAR

A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough...

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Main Authors WU, Chih-Chang, LEE, Chin-Szu, HSIEH, Meng-Chun, TSAI, Tsung-Yu, HUANG, Hsing-Yuan, WU, Szu-Hua
Format Patent
LanguageEnglish
Published 02.03.2023
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Summary:A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.
Bibliography:Application Number: US202117461147