METHOD OF DETERMINING CONTROL PARAMETERS OF A DEVICE MANUFACTURING PROCESS

A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the...

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Main Authors SLACHTER, Abraham, MASLOW, Mark John, VAN GRORP, Simon Hendrick Celine, ANUNCIADO, Roy, STAALS, Frank, WARNAAR, Patrick, VAN INGEN SCHENAU, Koenraad, TEL, Wim Tjibbo, JOSEN, Marinus
Format Patent
LanguageEnglish
Published 23.02.2023
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Summary:A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.
Bibliography:Application Number: US202217973221