METHODS FOR PROCESSING SEMICONDUCTOR STRUCTURES AND METHODS FOR FORMING SEMICONDUCTOR STRUCTURES

Embodiments of the present application provide a method for processing a semiconductor structure and a method for forming a semiconductor structure. The method for processing a semiconductor structure includes: providing a semiconductor substrate, the semiconductor substrate being provided with a fe...

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Bibliographic Details
Main Author XI, Ning
Format Patent
LanguageEnglish
Published 23.02.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments of the present application provide a method for processing a semiconductor structure and a method for forming a semiconductor structure. The method for processing a semiconductor structure includes: providing a semiconductor substrate, the semiconductor substrate being provided with a feature portion, the aspect ratio of the feature portion being greater than a preset aspect ratio, a mask layer being provided on the top of the feature portion; ashing a semiconductor structure, the semiconductor structure comprising the semiconductor substrate, the feature portion, and the mask layer; cleaning the semiconductor structure; drying the semiconductor structure; and removing the mask layer.
Bibliography:Application Number: US202117438454