DOUBLE VACUUM AND POSITIVE PRESSURE FOR PASTE BOND JOINTS
A method eliminates voids in the bond line and manipulates a thickness of the bond line. This method includes: applying an adhesive at a center of an area of a structure; placing a doubler on the adhesive over the area of the structure, wherein the doubler has a peripheral edge; and maintaining a ne...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
09.02.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A method eliminates voids in the bond line and manipulates a thickness of the bond line. This method includes: applying an adhesive at a center of an area of a structure; placing a doubler on the adhesive over the area of the structure, wherein the doubler has a peripheral edge; and maintaining a negative pressure at the peripheral edge of the doubler while simultaneously maintaining a positive pressure at the doubler to purge entrapped gases and control a thickness of the bond line at the peripheral edge of the doubler. |
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Bibliography: | Application Number: US202117397443 |