BONDING STRUCTURE AND ELECTRONIC DEVICE

A bonding structure includes a substrate, a first sensing electrode layer, a second sensing electrode layer, an optical film layer, and a protective layer. The substrate has opposite first and second surfaces. A sensing area and a bonding area are defined on the substrate. The first sensing electrod...

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Bibliographic Details
Main Authors Chen, Bao Huang, Xu, Xian Bin, Chang, Chen-Hsin, Zhang, Xiong Min, Hung, Po-Pin, Lu, Qing Hui
Format Patent
LanguageEnglish
Published 02.02.2023
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
PHYSICS
TRANSPORTING
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Summary:A bonding structure includes a substrate, a first sensing electrode layer, a second sensing electrode layer, an optical film layer, and a protective layer. The substrate has opposite first and second surfaces. A sensing area and a bonding area are defined on the substrate. The first sensing electrode layer is disposed on the first surface. The second sensing electrode layer is disposed on the second surface. The optical film layer covers the first sensing electrode layer and has a first bonding opening located in the bonding area. The protective layer covers the second sensing electrode layer and has a second bonding opening located in the bonding area. The first and second bonding openings respectively expose a part of the first sensing electrode layer and a part of the second sensing electrode layer and are misaligned in a direction perpendicular to the first or second surface.
Bibliography:Application Number: US202117391130