CLEANING APPARATUS FOR SEMICONDUCTOR WAFER AND METHOD OF CLEANING SEMICONDUCTOR WAFER

Provided is a cleaning apparatus and a cleaning method for semiconductor wafers that can hinder a mist of a cleaning solution from being adhered to a surface of a semiconductor wafer during cleaning of the semiconductor wafer. In a cleaning apparatus 1 for a semiconductor wafer, a spin cup 20 has an...

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Bibliographic Details
Main Authors OHKUBO, Kazuhiro, NODA, Kaito, TOMITA, Michihiko, NAKAO, Yuki
Format Patent
LanguageEnglish
Published 02.02.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided is a cleaning apparatus and a cleaning method for semiconductor wafers that can hinder a mist of a cleaning solution from being adhered to a surface of a semiconductor wafer during cleaning of the semiconductor wafer. In a cleaning apparatus 1 for a semiconductor wafer, a spin cup 20 has an annular side wall portion 21; an inclined portion 22 that is inclined toward the rotating table 13; and an annular bent portion 23. The height position h21 of the upper end portion 21c of the side wall portion 21 is set at a position lower than the height position h14a of the upper end portion 14a of the wafer retainer portion 14, and the inclination angle θ22 of the inclined portion to a horizontal plane and the width w of the inclined portion satisfy a formula (A):θ22(°)≥−0.65×w (mm)+72.9°  (A)
Bibliography:Application Number: US202017791769