SPINTRONIC DEVICES WITH SELF-COOLING FUNCTION
Embodiments of the present disclosure generally relate to spintronic devices, and more specifically to self-cooling spintronic devices. In an embodiment, a device is provided. The device includes a spintronic device having a first side and a second side opposite the first side, a first layer dispose...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
02.02.2023
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments of the present disclosure generally relate to spintronic devices, and more specifically to self-cooling spintronic devices. In an embodiment, a device is provided. The device includes a spintronic device having a first side and a second side opposite the first side, a first layer disposed on the first side, and a second layer disposed on the second side, the first layer having a Seebeck coefficient that is different from a Seebeck coefficient of the second layer. |
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Bibliography: | Application Number: US202117387270 |