METHODS AND SYSTEMS FOR WAFER SCALE TRANSDUCER ARRAY FABRICATION

Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with...

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Bibliographic Details
Main Authors Dacruz, Edouard, Barrett, Jason, Daloz, Flavien
Format Patent
LanguageEnglish
Published 26.01.2023
Subjects
DIAGNOSIS
ELECTRICITY
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
MEDICAL OR VETERINARY SCIENCE
SURGERY
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Summary:Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.
Bibliography:Application Number: US202217938567